In a new product announcement, GIGABYTE is launching two of its most exciting products. The Z690 AERO and the Z370 AORUS GAMING 3 both offer impressive features that set them apart from their peers.
The “msi z690 motherboard” is a gaming motherboard that GIGABYTE has announced. It offers high-end components for gamers who want to build an ultra-high performance PC.
GIGABYTE (photo credit: GIGABYTE)
The AERO and AORUS Z690 motherboards from GIGABYTE are designed for aggressive overclocking and content production. In September, a list of more than 25 models was leaked, but the current release validates their specs. Premium models may be of interest to gamers seeking for a significant increase. They are intended for severe overclocking of the Intel Core i9-12900K, with a 20+1+2 phases power supply system and up to a 20 ounce, 10-layer PCB. The flagship CPU was clocked at 8 GHz on one motherboard.
Power architecture with 20+1+2 phases
The 20+1+2 phase power architecture enhances CPU overclocking stability. The new LGA1700 socket and the 12th Gen Intel Core processors indicate a transition in the process design on both the architecture and the process design, which implies customers will be unable to utilize earlier CPUs by modifying firmware or hardware details owing to the incompatible socket. The new architecture includes Intel 7 stepping and a “hybrid” P-Core and E-Core design that not only boosts theoretical performance but also allows processors to dynamically transition between high performance and low-load energy-saving mode. This helps users to get the most out of their processors while yet being able to adapt to the demands of system functioning. The flagship of GIGABYTE Z690 AORUS gaming motherboards unlock the full potential of the new processors and enhance extreme overclocking performance on all-core multi cores with up to 20+1+2 phases, each of Vcore and Vcc GT can hold up to 105 amps by its Smart Power Stage design, while Vcc AUX can hold 70 amps by two sets of DrMOS design. Meanwhile, the robust pin sockets and a variety of high-quality components can offer more stable power and effectively dissipate heat from severe loads or overclocking to minimize CPU throttling due to overheating, as well as supply up to 2300 Amps for the greatest power balance. Furthermore, the use of Tantalum Polymer capacitors enhances the VRM’s transient response between high and low loads, hence boosting the stability and purity of the power for processors, removing the risk of overlocking problems caused by unstable power. The Intel Core i9-12900k reached a high overclocked frequency of 8 GHz.
DDR5 or DDR4 will be supported in certain models. There were no new data on DDR4 compatibility, however DDR5 versions can run at speeds ranging from 4,800 MHz to over 8,000 MHz (using LN2 cooling). There’s a DDR5 Unlocked Voltage function that lets you unlock factory voltage limits, as well as a one-click auto-overclocking option. Users may choose from pre-loaded profiles or utilize XMP 3.0 to develop their own with XMP booster.
Memory Support for Specific Models
Starting with Intel Z690 consumer motherboards, GIGABYTE offers DDR5 memory with DDR4 compatibility at the bottom, and provides a variety of Z690 motherboards for customers based on market demand and positioning variances. DDR4 versions work well, while DDR5 models benefit from a new memory architecture that allows for speeds as high as 4800 MHz while maintaining excellent power efficiency, low latency, and low power consumption. GIGABYTE Z690 motherboards feature the newest SMD memory DIMMs and dual metal armor, in addition to the well-known Shielded Memory Routing, to provide customers with excellent memory overclocking performance with increased durability and stability. The real-world test also confirms that LN2 overclocking performance may be increased to 8000 MHz and higher.
Fins-Array III technology has boosted the surface area of onboard heatsink thermal fins by nine times over prior versions. In the VRM region, there’s also an 8 mm direct contact heatpipe and a new generation LAIRD 9W/mK thermal pad. A nano-carbon covering will be available on some high-end AORUS motherboards.
Improvements in Cooling
GIGABYTE Z690 AORUS MASTER and above motherboards utilize the next generation Fins-Array III technology, which increases the surface area of the thermal fin to 9 times that of a standard heatsink, allowing it to absorb more heat as cool air passes by for improved heat dissipation. The Direct-Touch Heatpipe II design uses an 8mm direct touch heatpipe with a shorter distance and larger contact area between the heatpipe and the heatsink, allowing temperatures to be lowered more quickly. In the meanwhile, some GIGABYTE Z690 AORUS motherboards have a new generation LAIRD 9W/mK thermal pad in the VRM region, which provides much better heat dissipation than standard thermal pads.
In addition, certain AORUS motherboards include a metal back plate with nano-carbon coating for an attractive thermal design, and some Z690 AORUS models have the full-covered one-piece metal plate on the MOS region from the previous design for more effective heat dissipation. The heatsink’s many skived fins and grooved surface give two times the dissipation area of standard designs, greatly improving heat convection and conduction by enabling more airflow to pass through it. GIGABYTE Z690 motherboards use 6-layer PCBs or higher, with high-end variants using up to 10-layer PCBs. Both the power and ground layers employ 2OZ copper for improved heat dissipation during high-speed CPU operation, preventing throttling due to overheating. Aside from the VRM’s hardware thermal design, GIGABYTE Z690 motherboards have Smart Fan 6 technology and EZ Tuning for more flexible fan allocation, simpler fine tuning, and advanced manually setting modes. Users may now fine-tune the temperature of their gaming systems for the best blend of quiet, cool, and high performance.
The top AORUS models now include 10 Gbps networking choices, as well as Intel WiFi 6E 802.11ax. USB 3.2 Gen2x2, 3.2 Gen2 ports, and Thunderbolt 4 / USB 4 are all available.
USB and networking
For the most full and versatile network choices, the GIGABYTE Z690 AORUS portfolio includes 2.5Gb Ethernet, up to 10Gbit on flagship models, and Intel WiFi 6E 802.11ax network. Aside from USB 3.2 Gen2x2, 3.2 Gen2 ports, and ThunderboltTM 4 / USB 4 extensions, GIGABYTE Z690 AORUS motherboards are fully loaded with the newest technology to fulfill the demands.
The top-end boards’ onboard audio has also been improved to enable DTS-X capability through an ESS SABRE DAC. The ESSential HEX USB DAC, which employs the ESS SABRE HiFi ES9280A audio codec with ESS ES9080A for independent channel processing, takes the AORUS Z690 Extreme a step further.
Audio
The top of the GIGABYTE Z690 AORUS series has a high-SNR audio engine, WIMA FKP2 studio-grade audio capacitors, and an ESS SABRE DAC with DTS:X Ultra to produce high-fidelity audio for the most expansive sound experience, whether gaming or entertaining. The ESSential HEX USB DAC, which is built-in ESS SABRE HiFi ES9280A audio codec with ESS ES9080A to process the left and right channel audio separately, perfectly presents the Linear Apodizing filter effect, reduces the distortion of the pure Linear mode, and further increases the depth and openness of the reverberation of the soundstage, is available on the flagship Z690 AORUS XTREME motherboard. Users may enjoy a more immersive audio experience without sacrificing sound quality due to the chassis’ acoustic layout design. The ESSential HEX USB DAC also supports audio output up to 40 kHz, enabling gamers to enjoy the most realistic sound experience and entertaining effects possible, regardless of their physiological constraints.
GIGABYTE is also launching three new AERO Z690 models, including one with DDR4 support. They are intended towards content production using VisionLINK technology. They include many of the same features as the AORUS range, as well as compatibility for high-powered pen displays up to 60 watts.
Models of the AERO Z690
Gigabyte also introduces three Z690 AERO-series motherboards for makers, in addition to the AORUS variants. The newest Z690 AERO series fully unleashes the tremendous performance of next generation CPUs while also providing outstanding thermal performance to maintain system stability. The Z690 AERO series, which supports PCIe 5.0, meets the high-speed bandwidth requirements of the next generation of graphics cards on the one hand, and provides optimal signal transferring quality on the other. Four PCIe 4.0 M.2 slots with armor design are included in the range, allowing developers to have enough storage space with excellent cooling without having to worry about thermal throttling during high-speed operation.
The Z690 AERO G and Z690 AERO G DDR4 have the well-known VisionLINK technology, which enables data and video transfer over the USB Type-C interface and delivers up to 60W of power to high-end pen displays. VisionLINK technology allows high-end graphics cards to share performance with pen displays through the DP IN interface, allowing content producers to work in a more fluid environment while minimizing cable clutter and conserving time, space, and effort. The VisionLINK TB on Z690 AERO D is a more sophisticated version of VisionLINK technology that includes full Thunderbolt 4 functions as well as a 60W power supply. Additionally, the 2.5Gbit Ethernet, Intel WiFi 6E 802.11ax network, USB 3.2 Gen2x2 and front Type-C interface assist artists in greatly increasing their productivity.
GIGABYTE is the source of this information (via PR Newswire)
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